Tenney Ships Reach-In Thermal Shock Chamber to the Electronics Industry

Posted: Sep 28, 2023

Tenney Environmental announced the shipment of reach-in thermal shock chamber to an electronics manufacturer. This chamber will be used for various types of thermal shock testing and is designed with a 2-zone vertical configuration. 

This thermal shock test chamber meets applicable test standards including MIL-STD202 Method 107, MIL-STD883 Method 1010, MIL-STD 750-1A, and more. The product under test is cycled between temperature extremes to expose faults in design or manufacturing. This cycling occurs by transferring the product basket between the vertical zones via an automated carriage transport system with a 200-pound load capacity.

This test chamber features an 8 cubic foot workspace and an overall height of 80” for ease of move-in. The work chamber dimensions are 25.5” W x 25.5” D x 21.75” H. The maximum temperature of the hot chamber is 200°C and 40°C for the cold chamber. The minimum temperature for the hot chamber is above ambient and -73°C for the cold chamber. 

The thermal shock chamber utilizes a cascade type refrigeration system with a water-cooled condenser. This chamber interior is constructed with a welded, vapor tight type-304 2B stainless steel liner. The horizontal compound airflow system maximizes the air circulation within the chamber and includes an adjustable air distribution system which allows the end user to fine tune the airflow specific to their product load configuration.

“Our thermal shock chambers are available in 2, 5, and 8 cubic foot sizes and designed with a vertical configuration to minimize their footprint. These chambers are capable of meeting industry standard MIL-STD tests and are great for automotive thermal shock tests as well.”  – Stephen Thompson, Applications Engineering Manager

Unique features of this Tenney thermal shock test chamber include: 

•    15 HP cascade refrigeration system (water cooled)
•    Synergy Quattro programmable temperature controller
•    Advanced Ethernet communications capabilities 
•    Over/under temperature protection system
•    Automated carriage transport system
•    Dry air purge system to minimize the buildup of moisture and prevent condensation on the product during testing.